Siemens EF 88H Series Manual de usuario Pagina 116

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Semiconductor Group 10-19
Device Specifications
C501
10.9 Package Outlines
P-DIP-40 Package Outlines
Plastic Package, P-DIP-40 for C501G-L / C501G-1R
(Plastic Dual in-Line Package)
GPD05883
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”
Dimensions in mm
SMD = Surface Mounted Device
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